World-Class Facilities, Collaborative Innovation
Through the Oklahoma Semiconductor Coalition, researchers, startups, and industrial partners gain access to advanced cleanrooms and testing equipment across our partner universities. This shared footprint accelerates prototyping and reduces the barrier to entry for microelectronics development.
OU Microelectronics Fab & Characterization
Located on the Norman campus, the OU facilities specialize in wide bandgap semiconductor physics, optoelectronic devices, and high-frequency prototyping. The labs support comprehensive device fabrication from raw substrate processing through to completed device testing.
Core Facilities & Equipment
- 4,000 sq ft Class 100 & Class 1000 Cleanroom
- Contact and Projection Photolithography
- Electron-Beam Evaporation & Sputtering Systems
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Reactive Ion Etching (RIE) for dielectric/semiconductor films
Facility Location
Norman, Oklahoma
OSU Packaging & Materials Testing
Located on the Stillwater campus and partnering with OSU-Tulsa, the OSU facilities focus heavily on advanced semiconductor packaging, thermal management, and harsh-environment reliability testing (including radiation-effects testing for aerospace applications).
Core Facilities & Equipment
- MOCVD Epitaxial Growth for wide-bandgap materials
- Flip-Chip & Wire-Bonding Packaging lines
- High-Resolution Transient Thermal Characterization
- Gamma-Ray & Neutron Irradiation Testing Chambers
- High-Resolution SEM & AFM Characterization
Facility Location
Stillwater / Tulsa, Oklahoma
