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Statewide Initiative

Pioneering Semiconductor Innovation in Oklahoma

The Oklahoma Semiconductor Coalition (OSC) unites leading academic institutions, state agencies, and industry leaders to build a robust ecosystem for microelectronics research, workforce development, and manufacturing excellence.

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OU Cleanroom Facility 1 OU Cleanroom Facility 2 OU Cleanroom Facility 3 OU Cleanroom Facility 4 OU Cleanroom Facility 5 OU Cleanroom Facility 6 OU Cleanroom Facility 7 OU Cleanroom Facility 8 OU Cleanroom Facility 9 OU Cleanroom Facility 10 OU Cleanroom Facility 11 OU Cleanroom Facility 12

Oklahoma Research & Development Hub

Interactive map of our regional facilities, recent scientific publications, and active coalition projects.

Active Oklahoma Facilities

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Recent Publications Fictional Data
Heterogeneous Integration of GaN on Silicon for High-Frequency Systems
Dr. A. Miller, Dr. R. Patel (OU Semiconductor Lab)
IEEE Transactions on Electron Devices • 2026
Thermal Reliability Analysis of 2.5D Semiconductor Packages
Prof. H. Chen, J. Smith (OSU Microelectronics Center)
Journal of Electronic Packaging • 2026
Radiation-Hardened ASIC Design for Next-Gen Aerospace Applications
Dr. S. Vance, et al. (OSC Aerospace Initiative)
IEEE Transactions on Nuclear Science • 2025
Electrostatic Discharge (ESD) Protection in Sub-10nm FinFET Technologies
Dr. L. Davis, K. Jones (OU Research Group)
Microelectronics Reliability • 2025
Heterogeneous Integration of GaN on Silicon for High-Frequency Systems
Dr. A. Miller, Dr. R. Patel (OU Semiconductor Lab)
IEEE Transactions on Electron Devices • 2026
Thermal Reliability Analysis of 2.5D Semiconductor Packages
Prof. H. Chen, J. Smith (OSU Microelectronics Center)
Journal of Electronic Packaging • 2026
Radiation-Hardened ASIC Design for Next-Gen Aerospace Applications
Dr. S. Vance, et al. (OSC Aerospace Initiative)
IEEE Transactions on Nuclear Science • 2025
Electrostatic Discharge (ESD) Protection in Sub-10nm FinFET Technologies
Dr. L. Davis, K. Jones (OU Research Group)
Microelectronics Reliability • 2025

Active Research Projects Fictional Data

Advanced Packaging

High-Density 3D Integration

Developing low-temperature copper-to-copper bonding techniques for next-generation multi-die packages.

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Wide Bandgap

GaN-on-Silicon Power Systems

Improving efficiency and thermal dissipation in gallium nitride power devices for electric vehicles.

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Aerospace / Defense

Rad-Hard Microcontrollers

Designing radiation-hardened-by-design (RHBD) integrated circuits for deep space exploration missions.

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National Footprint & Conferences

Our presence at nationwide semiconductor conferences and locations of our national industry partners.

National Partners & Upcoming Events

OKLAHOMA
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Managing Labs & Leadership Team

Meet the primary research facilities and the dedicated team driving the coalition's mission forward.

Coalition Laboratories

University of Oklahoma Labs

Specializing in wide bandgap semiconductor physics and device prototyping.

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Oklahoma State University Labs

Specializing in packaging, thermal modeling, and radiation-effects testing.

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Coalition Leadership

Dr. Elizabeth Vance Fictional

Executive Director, Oklahoma Semiconductor Coalition

Prof. Marcus Sterling Fictional

Director of Academic Research Collaboration